Electrical and Computer EngineeringECE 225 Semiconductor Processing and Bandgap Engineering

Addresses principles of semiconductor processing with applications for semiconductor materials engineering, research, and development. The materials fabrication and processing topics include preparation of silicon, III-V compounds, and dielectric thin films, including thin film deposition techniques, diffusion, ion implantation, and standard device fabrication sequences. Applications of these processing principles for semiconductor materials engineering and bandgap engineering in semiconductor heterostructures are discussed for devices, such as LEDs, lasers, photoreceptors, modulators, and high-speed transistors.

Requirements

Enrollment is restricted to graduate students.

Credits

5

Quarter offered

Winter

Instructor

Michael Oye